Led the entire process of production, including 13-step process

1.Led chip test

Microscopy: surface mechanical damage and whether the point Ma Ma Hang (lockhill chip size and electrode size of the compliance process required electrode pattern is complete
2.Led expansion film
As the Led chip dicing after the close spacing is still ranked very small (about 0.1mm), after the process is not conducive to the operation. We use expansion of the adhesive film machine film chip to expand, is stretching the distance between Led chips to about 0.6mm. Expansion can also be used manually, but it is easy to fall causing waste and other undesirable chip problem.

3.Led dispensing

The corresponding position in the Led support point of silver plastic or rubber insulation. (For GaAs, SiC conductive substrate, the back electrode has red, yellow, yellow and green chips, using silver glue. Insulating sapphire substrates for blue, green Led chips, using insulating glue to fix the chip.)
Process difficulty is the control of dispensing quantity in the gel height, dispensing locations are detaiLed process requirements.
As the silver plastic and rubber insulation in the storage and use are strict requirements in the wake of silver plastic materials, mixing, all processes must use the time to pay attention.
Preparation of rubber

4.Led

And dispensing the contrary, prepared rubber is first prepared by plastic machine plastic coated silver electrodes on the back of the Led, then back with a silver adhesive Led instalLed in the Led bracket. Preparation of rubber is much higher than the efficiency of dispensing, but not all products are for plastic process equipment.
5.Led hand stab film
After the expansion of Led chips (prepared or not prepared adhesive plastic) placed in puncture-chip platform fixture, Led support on the fixture under a microscope with a needle under a thorn Led chips 1 to the appropriate location. Manual and automatic loading rack barbed piece than a good, easy to change at any time different chips for multiple chips need to install the product.
6.Led automatically mounted
Automatic pallet is a combination of glue stick (dispensing) and the installation of two major steps chip, the first point in the Led bracket silver plastic (insulating plastic), then vacuum suction nozzle to Led chips from the mobile location, and then placed in corresponding bracket position. Automatically mounted in the main process equipment operation should be familiar with the program, and stick gum on the equipment and installation of precision adjustment. The selection of the best in the nozzle used bakelite nozzle to prevent surface damage on the Led chip, especially blue and green chips to be used bakelite for. Because the wedge will scratch the surface of the current diffusion layer chip.

7.Led sintering

The purpose is to make sintered silver glue curing, sintering temperature required to monitor, prevent the batch of bad. Silver plastic sintering temperature is controlLed at 150 ℃, sintering time of 2 hours. Based on the actual situation can be adjusted to 170 ℃. Insulating adhesive generally 150 ℃
Silver plastic sintering oven process requirements must be separated by 2 hours (or 1 hour) to open the replacement of sintered products, the middle are not free to open. Other purposes shall not fired oven, to prevent pollution.

8.Led bonding

The purpose of bonding the electrode lead to the Led chip to complete the product lead connections inside and outside work.
Led pressure welding process with gold bonding and aluminum wire bonding of two. The right is aluminum wire bonding process, the first Led chip electrode pressure in the first 1:00, then aluminum strands to the corresponding bracket above the pressure after the second point of tearing aluminum wire. Gold ball in the pressure welding process first before burning balls, like the rest of the process.
Pressure welding is a Led packaging technology in the key links in the main process is the need to monitor bonding gold (aluminum) wire arch shape, solder joint shape, tension.

9.Led seaLed plastic

Led package main some glue, potting, molding of three. Basically, the difficulty is the bubble process control, multi-material shortage, black spots. Designed mainly for material selection, use and support combined with a good epoxy. (Normal Led can not leak test)
9.1Led dispensing:
TOP-Led and Side-Led package for dispensing. Manual dispensing package to the operating level requirement is high (particularly white Led), the main difficulty is the control of dispensing quantity, because the process would be the use of epoxy thickens. Point white Led phosphor precipitation glue there a light chromatic aberration caused the problem.
9.2Led package Glue
Lamp-Led package in the form of using potting. Casting process is first in the Led cavity injection molding of liquid epoxy, and then insert a good Led bracket bonding, into the oven for epoxy curing, the Led from the mold cavity in the extrusion or molding.
9.3Led molded package
The bonding in a good Led bracket into the mold, the mold up and down two hydraulic clamping and vacuum, the solid epoxy glue Road, the entrance into the injection heat pressed into the mold with a hydraulic plunger glue Road, epoxy Shun Road access to each Led with plastic molding and curing tank.

10.Led curing and after curing

Curing is the curing of epoxy encapsulation, generally epoxy curing conditions 135 ℃, Molded package is generally 150 ℃,  After the curing is to allow epoxy to fully cure, and thermal aging of the Led. After the curing of epoxy and support for improving the (PCB) of the bond strength is very important. General conditions of 120 ℃,

11.Led cut tendons and dicing

As the Led in production are linked (not single), Lamp Led package uses Led Bracket Trim off with bars. SMD-Led is in a PCB board needed to complete the separation Dicing work.

12.Led test

Led's optical parameters of test and inspection dimensions, while Led products based on customer requests for sorting.

13.Led packaging

Count the finished product packaging. Super bright Led need anti-static packaging.

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